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Vapor chamber assemblies
A vapor chamber (VC) is a thermal management component that uses two-phase heat transport to quickly move heat within the assembly to improve thermal performance.
Vapor chambers have three main parts: a thin, vacuum sealed shell or envelope, a working fluid and a wick structure. The shell keeps the VC working fluid sealed for decades of consistent heat transport. The working fluid changes phase in the application temperature range and must be compatible with the vapor chamber shell and wick materials. The wick passively moves fluid through the vapor chamber.
A vapor chamber is a closed evaporator-condenser system. The sealed shell is a hollow vapor region lined with a capillary structure or wick. A working fluid at vapor pressure saturates the wick capillaries.
Liquid in the wick evaporates when the heat pipe starts absorbing heat. The vapor fills the vapor region, called the vapor space and diffuses heat evenly across the vapor chamber. Heat distribution happens quickly, giving the vapor chamber its high thermal conductivity properties.
Cooler regions of vapor chamber shell and wick absorb heat from the vapor. The vapor no longer has enough latent energy to maintain a gaseous form, condenses back into liquid and seeps into the wick structure. Capillary action within the wick returns the condensate to warmer vapor chamber regions and completes the operating cycle.
Vapor chambers can effectively conduct heat 10 to 50 times more than solid metal structures, possess higher through-plane conductivity than graphite for thicker applications and requires minimal design changes. Vapor chambers evenly spread heat, so designers have flexibility in placing heat sources, the ability to increase the power of the components or can reduce the overall size of the thermal management solution for smaller products. Smaller heat sink solutions enabled by vapor chambers improve system packaging and provide quieter operation by requiring less air flow.
Utilizing Eaton's innovation and technical expertise in vapor chambers, customers can push their product design and performance. Our vapor chamber technologies enable cooling for next level processing speed and power in the same space. Ultra-thin vapor chamber formats keep products thin while enhancing heat spreading. Eaton is an ideal partner with broad customization options and high quality fabrication honed from decades of two-phase solution manufacturing.
Eaton integrates vapor chambers into specialized air cooled heat sinks to improve heat distribution to each of the fins, improving the overall performance of the heat sink. Typical copper-water sintered powdered wick provides high-heat flux heat dissipation, with some configurations reaching over 300 W/cm2. Customers can improve air cooled heat sink performance up to 30% when compared to typical aluminum or copper base spreaders. Leveraging vapor chambers includes all the benefits of added thermal performance, freeze/thaw resilience and ability to withstand military shock and vibration standards without sacrificing the reliability of the assembly.
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