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Eaton has taken the concept of vapor chamber heat spreading to the next dimension with specialized air-cooled heat sinks that incorporate vapor chambers not only in the base, but in the fins as well. Attached to the vapor chamber extensions are high density stamped, zipper or folded fins, resulting in a 3D vapor chamber heat sink assembly. This compact fin structure paired with fast heat spreading of vapor chambers enable 3D vapor chamber heat sink assemblies to provide isothermal, high-performance air-cooled thermal management. These compact, high-performance air-cooled heat sinks are designed to meet the most demanding electronics cooling requirements in both commercial and military applications.
Vapor chambers utilize the high heat capacity of fluid phase change in a robust format, making them one of the most efficient and versatile thermal management technologies to reliably and quickly transport heat.
Eaton has two styles of 3D vapor chambers: one with vertical round tube extensions from the main vapor chamber region and one with flat tube extensions. 3D vapor chamber heat sink assemblies are typically configured for 2U to 6U rack heights, but can be designed to fit and perform in your custom application.
By extending the vapor space from its traditional 2D format used for heat spreading, a 3D vapor chamber spreads heat into the whole assembly. By promoting isothermal temperatures inside the entire usable volume, 3D vapor chambers enable the maximum thermal performance for air cooled solutions.
Eaton engineers leverage decades of two-phase cooling innovations to drive the limit of air-cooled solutions with 3D vapor chamber assemblies. Our internal thermal design software enables our team to shorten design cycles and maximize thermal performance in your specific application constraints. Paired with our advanced, high-quality two-phase manufacturing techniques, our engineers can help you extend the performance of air-cooling for your system.
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