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Sockets

Logic sockets

Logic sockets play a crucial role in electronic testing and reliability assessment. These versatile components facilitate seamless connections between integrated circuits (ICs) and test equipment. Logic sockets also allow for quick insertion and extraction of IC packages during critical stages such as HTOL, LTOL, THB, HAST, PTC, ESD and latch up. Whether it’s functional testing, programming or burn-in procedures, logic sockets ensure robustness and reliability across various industries.

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Swift responsiveness
Quick response to product availability, quote and technical support inquiries ensure prompt assistance and efficient service
Optimize demanding test cycles
Withstand harsh reliability test environments with robust socket designs
Reduce lead times
Enable rapid design iterations with Eaton’s decades of interconnect, thermal and design expertise and robust, proprietary modeling tools, which result in shorter lead times
Diverse socket range
Meet diverse and variable requirements with Eaton’s wide array of sockets
Efficient socket family iteration
Swiftly iterate socket designs within product families enhancing efficiency and streamlining development processes

Logic sockets: roles in burn-in and reliability testing

Logic sockets fulfill crucial roles not only in production burn-in applications but in a broader spectrum of reliability tests. While production burn-in demands higher socket volumes, reliability tests present diverse scenarios where logic sockets play an integral role to ensure integrated circuit (IC) durability and longevity.

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Navigating burn-in strategies: logic sockets’ versatility

For logic sockets, certain applications need 100% production burn-in, such as critical mission operations, automotive systems, specific medical devices and aerospace and defense electronics. However, even amidst the strict regimen of 100% burn-in, some applications strategically transition to sample lot burn-in. This shift aims to boost efficiency while maintaining reliability standards, showcasing the adaptability and versatility of logic sockets in meeting the ever-evolving needs of the electronics industry.

Elevating semiconductor testing: Eaton’s quality commitment

In semiconductor production, reliability and characterization testing sockets undergo stringent evaluations, emphasizing meticulous assessments, persistent efforts to enhance stability and an unyielding dedication to maintaining unwavering quality standards. Eaton’s test sockets proactively identify potential vulnerabilities, consistently striving for advancement and ensuring adherence to the most rigorous benchmarks of quality and reliability throughout their entire operational lifecycle, from initial evaluation to prolonged usage.

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Elevating excellence: Eaton’s dynamic approach in the reliability segment

Eaton’s logic business focuses on critical capabilities to succeed and expand within the reliability segment. This entails developing family socket designs that can rapidly evolve to meet changing needs. Eaton prioritizes rapid responses to inquiries for product availability, quotes and technical support, ensuring timely product delivery with lead times of 4 to 6 weeks and demonstrating a commitment to exceptional customer service. Our diverse product range effectively meets varied customer requirements and industry demands.

Innovating durability: Eaton’s cutting-edge logic burn-in sockets

Eaton excels in the reliability testing segment with our highly reliable logic Burn-In Sockets, which leverage groundbreaking contact technology for robust electrical and mechanical connections. With decades of semiconductor expertise, we innovate continuously to develop cutting-edge contact solutions, ensuring precise testing while safeguarding semiconductor components. Our sockets boast a lifetime rating, enduring up to 10,000 insertions and withdrawals, demonstrating their durability and sustained performance in reliability testing.

Sockets
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Specifications

QFN sockets

Package type

Series

Pitch (mm)

Max pkg size (mm)

Max array

Socket style

Mounting style

Contact type
QFN 716 0.35 / 1.27 12 x 14   Open top Compression Spring probe
QFN 717 0.35 / 1.27 14 x 16   Open top Compression Spring probe
QFN 776P 0.65 / 1.27 10 x 10 18 x 18 Open top Through Hole Buckle beam
QFN 790 0.4 / 0.8 12 x 12 27 x 27 Open top Through Hole Cantiliver

QFP sockets

Package type

Series

Pitch (mm)

Max pkg size (mm)

Pin count

Max array

Socket style

Mounting style

Contact type
QFP 3000 0.4 - 0.8 28 x 28 32 - 208 52x52 Open top Through Single beam - cantiliver
QFP 680, 680H, 680HA 0.4 - 0.8 28 x 28 48 - 176 44x44 Open top Through Top loaded dual beam - cantilever
QFP CQF 0.4 - 0.8 24 x 24 64 - 176   Open top Through Side loaded dual beam - cantilever

XSOP sockets

Package type

Series

Pitch (mm)

Pin count - range

Socket style

Mounting style

Contact type
SOP / SOIC 652 1.27 8 - 44 Open top Through hole Cantilever
SSOP 656 0.5 - 0.8 8 - 60 Open top Through hole Cantilever
TSSOP 676 0.65 8 - 20 Open top Through hole Cantilever
TSOP II 696 0.5 - 0.8 54 - 86 Open top Through hole Cantilever
TSOP I 648 0.5 - 0.55 28 - 56 Open top Through hole Cantilever

CSP FBGA BGA logic socket line-up

 

Package type

 

Series

Pitch (mm)

Max pkg size (mm)

Max array

Socket style

Mounting style

Contact type
FBGA / CSP 715P 0.35 - 1.27 12 x 14 Consut PM Open top Compression Spring probe
FBGA / CSP 718P 0.35 - 1.27 14 x 16 Consut PM Clamshell Compression Spring probe
FBGA / CSP 772 0.4 11 x 11 34 x  34 Open top Compression Buckle beam
FBGA / CSP 773 0.4 11 x 11 22 x 22 Open top Compression Buckle beam
FBGA / CSP 774 0.5 16 x 16 30 x 30 Open top Compression Buckle beam
FBGA / CSP 775 0.5 16 x 16 30 x 30 (300 IO max) Open top Compression Buckle beam
FBGA / CSP 776 0.5 / 0.65 16 x 16 24 x 24 Open top Through Hole Buckle beam
FBGA / CSP 892 0.4 - 1.0 16 x 16 30 x 30 Clamshell Compression Buckle beam
FBGA / CSP 777 0.75 / 0.8   15 x 15 Open top Through Hole Pinch
BGA CBG-XXX 0.65 / 1.27 Consult PM Consut PM Open top Through Hole Pinch
BGA FBGA-XXX 0.65 / 1.27 Consult PM Consut PM Open top Through Hole Pinch
FBGA / BGA Q118 / Q318 0.4 / 1.27 18 x 18 Consut PM Clamshell Compression Spring probe
FBGA / BGA Q323 0.4 / 1.27 23 x 23 Consut PM Clamshell Compression Spring probe
FBGA / BGA / LGA 859 0.8 / 1.0 35 x 35 Consut PM Clamshell Compression Buckle beam / spring probe
FBGA / BGA Q340 0.4 / 1.27 40 x 40 Consut PM Clamshell Compression Spring probe
FBGA / BGA / LGA 861 0.8 / 1.0 45 x 45 Consut PM Clamshell Compression Buckle beam / spring probe
FBGA / BGA / LGA 863 0.8 / 1.0 55 x 55 Consut PM Clamshell Compression Buckle beam / spring probe
FBGA / BGA / LGA 869 0.8 / 1.0 65  x 65 Consut PM Clamshell Compression Buckle beam / spring probe
Eaton is an intelligent power management company dedicated to improving the quality of life and protecting the environment for people everywhere. We are guided by our commitment to do business right, to operate sustainably and to help our customers manage power ─ today and well into the future. By capitalizing on the global growth trends of electrification and digitalization, we’re accelerating the planet’s transition to renewable energy and helping to solve the world’s most urgent power management challenges.
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