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Immersion cooling is a specialized system that leverages the high heat capacity and rapid heat transport of two-phase cooling in systems designed to dissipate massive amounts of heat. This system utilizes an innovative approach specifically designed for cooling the highest heat load applications such as generative AI systems, hyperscale computing and supercomputers.
Mounting boiler plates to high performance chips quickly and efficiently removes heat from sensitive components when placed in an immersion cooling system. Customers can boost performance for chips with high heat dissipation where standard air cooled or liquid cooled solutions cannot meet application requirements.
Immersion cooling is a thermal management solution where high heat flux components such as CPUs and GPUs are submerged in a tank of thermally conductive dielectric liquid and heat is transferred away from the heat source using a boiler plate.
Liquid immersion cooling systems include a boiler plate attached to a heat source that is immersed in a dielectric fluid. The immersion liquid boils when it contacts the plate, absorbing heat from the plate and the connected heat source. The bubbles that boil up in the fluid bring the heat to the surface and reject the heat from the system where it condenses at a heat exchanger or coil.
Eaton immersion cooling boiler plates are extremely high performance differentiated with a boiling enhancement surface (BEC) optimized with high wicking and boiling capacity to ensure consistent fluid flow to the surface.
Our engineering team is well-equipped to meet custom design, performance and mounting requirements for specific applications. Eaton's engineers are trained to choose the best BEC, base and frame materials, identify the right fluid and utilize a BEC configuration to optimize your system.
In Eaton standard immersion cooling boiler plates, the BEC is assembled within an aluminum mounting frame which provides high mounting forces to enable thin thermal interface material bond lines while still maintaining the structural integrity of the board. Our immersion boiler plates come preassembled with Intel® Xeon® or AMD SP3 compatible hardware and pre-applied with thermal grease for fast installation. For more specialized applications, contact our engineering team to develop the best-fit solution for your project.
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