Meet application requirements with the right aluminum extrusion solution

Eaton’s broad array of extruded heat sink profiles and advanced manufacturing methods enable us to fabricate optimized heat sinks to meet demanding application requirements. Our aluminum extrusions utilize alloys 6063 and 6061 for their high thermal conductivity.

• Extruded aluminum heat sink
• Max clip™ heat sink system

Extruded aluminum heat sinks

An extruded aluminum heat sink is one of the most popular and cost-efficient heat sink fabrication methods. Eaton produces a range of standard extruded heat sink options to have quick solutions optimized for board-level devices. Standard heat sinks are pre-cut. Finished heat sinks that include installation hardware are available with different mounting holes and pre-applied thermal interface materials to streamline PCB assembly. Eaton’s standard DC/DC converter heat sinks are designed to cool half, quarter and one-eighth brick sizes as well as the Vicor style footprint.

Aluminum extrusion profiles

For applications that require more customization, we utilize our broad extrusion profile library to develop custom and semi-custom air cooled solutions. Eaton extruded heat sink profiles range from simple flat back fin structures to complex geometries for optimized cooling. If a standard profile extrusion doesn’t meet your application requirements, our engineering team has spent decades designing new extrusions, balancing manufacturability with heat sink function. Contact our engineering team if you have a project that you think would benefit from a custom extruded heat sink.

Max Clip™ heat sink system

Eaton’s Max Clip™ System is a high-performance, low-cost thermal solution for discrete power semiconductors. The thermal system combines Eaton’s Max Clips with specialized extruded Max Clip heat sinks for optimized thermal contact, eliminating the need for mounting holes, screws or rivets. The Max Clip™ system accommodates a variety of semiconductor packages including TO-220, TO-218, TO-247, TO-3P and packages without mounting holes like TO-262, TO-273, TO-274 and TO-251.

Max Clips™

Max Clips™ are quick, robust attachments that save on labor and hardware costs while increasing design flexibility. Max Clips™ apply consistent, uniform pressure at the center of the semiconductor, improving contact with the heat sink for better thermal performance and maximum component reliability. With traditional hardware, mounting force is set at the time of assembly and decreases over the product’s service life. Max Clips™ enable long-term reliability with sustained mounting pressure. We offer more than 50 Max Clip extrusion profiles featuring specialized geometries and groove patterns optimized for use with over 20 different Max Clips to suit a wide range of applications.